Bosch has announced it is making the biggest investment in its history to meet the demands of an increasingly connected world.
The company is investing a billion euros ‘to build a wafer fab’ in Dresden – in an area labelled ‘Silicon Saxony’. The new plant will make chips for internet of things (IoT) devices and applications.
“Semiconductors are the core components of all electronic systems. With connectivity and automation growing, they are being used in more and more areas of application. By extending our semiconductor manufacturing capacity, we are giving ourselves a sound basis for the future and strengthening our competitiveness,” said Dr Volkmar Denner, chairman of the board of management of Robert Bosch GmbH.
Construction of the new facility is due to be completed by the end of 2019.